COPONYL™

Protective masking for heat process

It is suitable for protective masking in heat process because of the heat resistance. It is silicone-free and can be used for electronics products.

Grade

Technical data

It has superior performance of heat resistance and prevention of surface adhesive deposit under high temperature condition. There are wide range of adhesion types from medium to slight.

Grade Resin Properties Adhesion Properties Characteristics
Resin Content
(%)
Viscosity
(mPa・s/25℃)
Solvent Curing Agent Coating Thickness
(μm)
Adhesion(N/25mm) Stain Resistance under High Temperature
Type Amount HC-PET Glass HC-PET Glass
23℃/
0.5hr
150℃/
1.5hr
23℃/
0.5hr
150℃/
1.5hr
150℃/
1.5hr
150℃/
1.5hr
N-4901 35.0±1.5 7000±1000 Ethyl acetate /
Toluene
T-C 3.5 15 0.17 0.56 0.16 0.28 Slight adhesion, Heat resistant
N-4900 38.0±1.5 2500±500 Ethyl acetate /
Toluene
T-C 3.8 15 0.12 0.39 0.11 0.19 Slight adhesion, Heat resistant
N-9352
(Development article)
38.0±1.5 5500±1500 Ethyl acetate /
Toluene
T-C 3.8 15 0.09 0.30 0.08 0.15 Slight adhesion, Heat resistant, Prevention from temporal chage of adhesion
N-9177 40.0±1.5 5000±1500 Ethyl acetate HX 4.0 15 4.9 11.6 7.5 14.2 Medium adhesion, Acid-free
N-9178
(Development article)
35.0±1.5 6000±1500 Ethyl acetate /
Toluene
HX 2.5 15 0.73 1.8 0.56 2.9 Medium adhesion, Acid-free, Heat resistant
N-9176 40.0±1.5 7000±1500 Ethyl acetate HX 4.0 15 0.16 0.42 0.14 0.53 Weak Adhesion, Acid-free
N-9351
(Development article)
35.0±1.5 4000±1500 Ethyl acetate /
Toluene
HX 4.8 15 0.06 0.07 0.06 0.07 Slight adhesion, Acid-free, Prevention from temporal chage of adhesion

"*Aging: 40℃×7days
*Adhesion: Tested on PET(38μm) substrate"

Testing Methods (COPONYL)

NOTE: COPONYL is a trademark of The Nippon Synthetic Chemical Industry Co., Ltd. (NIPPON GOHSEI).

Inquiries

Feel free to contact NIPPON GOHSEI for technical inquires and ordering or to request catalogs, pricing estimates, etc.

03-6436-2815

Page Top