COPONYL™

UV Releasable Type

These adhesives can improve process efficiency due to the easy-rereasable characteristics, used in semi-conductor manufacturing process and surface protection of LCD and touch panels.

Grade

Technical data

UV releasable type / for semi conductor manufucturing process
These are adhesion decreasing adhessibility by UV irradiation, used for surface protection in working process.

Grade Resin Properties Adhesion Properties Characteristics
Resin Content
(%)
Viscosity
(mPa・s/25℃)
Solvent Curing Agent Photo Initiator Adhesion
(N/25mm)
Optical Properties
Type Amount Type Amount Adhesion Thickness
(μm)
SUS-BA Haze
(%)
Before UV Irradiation After UV Irradiation
N-3527 40.0±1.5 4500±500 Ethyl acetate /
Toluene
L-55E 1.0 I-184 1.4 25 13.8 0.18 31 Strong initial adhessibility, High elongation after UV cure
N-4001 40.0±1.5 2000±500 Ethyl acetate /
Toluene
L-55E 1.0 I-184 1.4 25 18.8 0.18 20 Strong initial adhessibility, High elongation after UV cure
N-4790 40.0±1.5 3000±1000 Ethyl acetate /
Toluene
L-55E 1.0 I-184 1.4 25 15.2 0.07 6 Strong initial adhessibility, Slight adhesion after UV irradiation
N-7521 40.0±1.5 3000±1000 Ethyl acetate /
Toluene
L-55E 1.0 I-184 1.4 25 8.2 0.07 5 Strong initial adhessibility, Slight adhesion after UV irradiation, Acid-free
N-4498 40.0±1.5 2200±500 Ethyl acetate /
Toluene
L-55E 1.0 I-184 1.4 25 5.0 0.06 8 Strong initial adhessibility, Slight adhesion after UV irradiation

*UV Irradiation : 180mJ/cm2 *Adhesion : Tested on PET(50μm) Substrates

Testing Methods (COPONYL)

NOTE: COPONYL is a trademark of The Nippon Synthetic Chemical Industry Co., Ltd. (NIPPON GOHSEI).

Inquiries

Feel free to contact NIPPON GOHSEI for technical inquires and ordering or to request catalogs, pricing estimates, etc.

03-6436-2815

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